Patent Assignment
Reel/Frame 039907/0467
Assignment of Assignor's Interest
Recorded: 2016-09-30
Pages: 5
Assignors
TOYAMA, FUMIAKI
Executed: 2016-09-21
OGAWA, HIROYUKI
Executed: 2016-09-23
FURIHATA, YOKO
Executed: 2016-09-24
KAI, JAMES
Executed: 2016-09-21
MIZUTANI, YUKI
Executed: 2016-09-21
YU, JIXIN
Executed: 2016-09-21
LIU, JIN
Executed: 2016-09-21
ALSMEIER, JOHANN
Executed: 2016-09-22
Assignee
SANDISK TECHNOLOGIES LLC
6900 NORTH DALLAS PARKWAY, SUITE 325, PLANO, TEXAS, 75024
Covered Property
(1)
Through-Memory-Level via Structures for a Three-Dimensional Memory Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →