Patent Assignment
Reel/Frame 039944/0242
Assignment of Assignor's Interest
Recorded: 2016-10-05
Pages: 10
Assignors
LEE, WOONG-SEOP
Executed: 2016-06-30
CHOI, JONGYOON
Executed: 2016-06-30
SHIN, JINHYUN
Executed: 2016-06-30
LEE, DONG-SIK
Executed: 2016-08-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-DI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same