Patent Assignment
Reel/Frame 039999/0560
Assignment of Assignor's Interest
Recorded: 2016-10-12
Pages: 5
Assignor
WATANABE, KENICHI
Executed: 2014-05-23
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-10-23, SHIN-YOKOHAMA-KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Device Having Groove-Shaped Via-Hole
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.