Patent Assignment
Reel/Frame 040023/0699
Assignment of Assignor's Interest
Recorded: 2016-10-14
Pages: 5
Assignors
WAKABAYASHI, TAISHI
Executed: 2016-08-30
MEGURO, KENJI
Executed: 2016-08-30
NAKANO, MASATAKE
Executed: 2016-08-30
YAGI, SHINICHIRO
Executed: 2016-09-01
YOSHIDA, TOMOSUKE
Executed: 2016-09-01
Assignee
SHIN-ETSU HANDOTAI CO., LTD
2-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Manufacturing a Bonded Soi Wafer