Method for manufacturing a bonded SOI wafer

1. A method for manufacturing a bonded SOI wafer by bonding a bond wafer and a base wafer, each composed of a silicon single crystal, via an insulator film, comprising, in sequential order, the steps of:

depositing a polycrystalline silicon layer on the bonding surface side of the base wafer,

polishing a surface of the polycrystalline silicon layer,

forming the insulator film on the bonding surface of the bond wafer,

forming an ion-implanted layer in the bond wafer,

bonding the polished surface of the polycrystalline silicon layer of the base wafer and the bond wafer via the insulator film, and

thinning the bonded bond wafer by delaminating along the ion-implanted layer in the bond wafer to form an SOI layer; wherein,

as the base wafer, a silicon single crystal wafer having a resistivity of 100 Ω·cm or more is used,

the step for depositing the polycrystalline silicon layer further comprises a stage for previously forming an oxide film on the surface of the base wafer on which the polycrystalline silicon layer is deposited,

the polycrystalline silicon layer is deposited by a method consisting of two growth stages, a first growth performed at a first temperature of 900° C. or more and 1010° C. or less, and a second growth performed at a second temperature of 1100° C. or more to deposit the polycrystalline silicon layer thicker than in the first growth,

deposition of the polycrystalline silicon layer is performed using trichlorosilane as a source gas at atmospheric pressure in the first growth and the second growth,

the oxide film is formed by wet cleaning,

the oxide film has a thickness of 0.3 nm or more and 10 nm or less, and

the polycrystalline silicon layer has a thickness of 2 μm or more when the base wafer and the bond wafer are bonded.