IP Library › Assignment 040066/0259
Patent Assignment
Reel/Frame 040066/0259

Assignment of Assignor's Interest

Recorded: 2016-10-19 Pages: 12
Assignors
SUGIURA, SHINOBU
Executed: 2016-10-06
KUWATA, YOSUKE
Executed: 2016-10-06
MIYASHITA, TOMOYASU
Executed: 2016-10-06
UMEKAWA, ATSUSHI
Executed: 2016-10-11
KIMURA, KAZUHIRO
Executed: 2016-10-11
HIRATSUKA, AKIHIKO
Executed: 2016-09-21
KATAOKA, KAORU
Executed: 2016-09-21
ARAI, RYOSUKE
Executed: 2016-09-21
Assignees
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-8980, JAPAN
TOKYO TECHNOLOGICAL LABO CO., LTD.
2-16-6 KURIHIRA, ASAO-KU, KAWASAKI-SHI, KANAGAWA, 215-0031, JAPAN
Covered Property (1)
Heating Part, Substrate Processing Apparatus, and Method of Manufacturing Semiconductor Device
Application: 15/272,798 →
Publication: US 2017/0107620
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 1, 2019
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048756/0699 →
Assignment of Assignor's Interest Apr 25, 2019
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 049008/0028 →