Patent Assignment
Reel/Frame 049008/0028
Assignment of Assignor's Interest
Recorded: 2019-04-25
Pages: 6
Assignor
HITACHI KOKUSAI ELECTRIC INC.
Executed: 2019-03-29
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Properties
(19)
Semiconductor Wafer Processing Apparatus for Transferring a Wafer Mount
Patent:
6,462,411 →
Application:
09/205,299 →
Treatment Object Conveyor Apparatus, Semiconductor Manufacturing Apparatus, and Treatment Object Treatment Method
Patent:
6,190,104 →
Application:
09/326,673 →
Substrate Processing Apparatus
Patent:
6,485,604 →
Application:
09/391,062 →
Method for Producing a Semiconductor Device
Patent:
6,204,199 →
Application:
09/393,276 →
Semiconductor Producing Apparatus and Temperature Control Method Therefor
Patent:
6,496,749 →
Application:
09/413,467 →
Substrate Processing Apparatus and Substrate Processing Method
Patent:
6,582,174 →
Application:
09/491,491 →
Substrate processing apparatus and substrate processing method
Patent:
6,251,189 →
Application:
09/502,219 →
Semiconductor Manufacturing Method and Semiconductor Manufacturing Apparatus
Patent:
6,368,049 →
Application:
09/544,463 →
Manufacturing Method for Semiconductor Device and Semiconductor Manufacturing Apparatus
Patent:
6,573,178 →
Application:
09/556,160 →
Semiconductor Device Manufacturing Method and Semiconductor Manufacturing Apparatus
Patent:
6,486,083 →
Application:
09/675,192 →
Method for Manufacturing Semiconductor Device, Substrate Treatment Method, and Semiconductor Manufacturing Apparatus
Semiconductor Device Manufacturing Method and Semiconductor Manufacturing Apparatus
Plasma Generator, Ozone Generator, Substrate Processing Apparatus and Manufacturing Method of Semiconductor Device
Substrate Processing Apparatus
Method of Manufacturing a Semiconductor Device, Substrate Processing Apparatus and Recording Medium
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Substrate Processing Method, Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-Transitory Computer-Readable Recording Medium
Heating Part, Substrate Processing Apparatus, and Method of Manufacturing Semiconductor Device
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 11, 2013
From: HIROSE, YOSHIRO; MIZUNO, NORIKAZU
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 031463/0366 →
Assignment of Assignor's Interest
Oct 11, 2013
From: YANAGITA, KAZUTAKA; HIGASHINO, KATSUKO
To: L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE
Reel/Frame 031463/0233 →
Assignment of Assignor's Interest
Jul 29, 2014
From: HIROSE, YOSHIRO; MIZUNO, NORIKAZU; YANAGITA, KAZUTAKA; OKUBO, SHINGO
To: HITACHI KOKUSAI ELECTRIC INC.; L'AIR LIQUIDE SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE
Reel/Frame 033413/0460 →
Assignment of Assignor's Interest
Sep 11, 2014
From: HIROSE, YOSHIRO; MIZUNO, NORIKAZU; YANAGITA, KAZUTAKA; OKUBO, SHINGO
To: HITACHI KOKUSAI ELECTRIC INC.; L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE
Reel/Frame 033721/0853 →
Assignment of Assignor's Interest
Mar 25, 2015
From: HITACHI, LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 035249/0082 →
Assignment of Assignor's Interest
May 8, 2015
From: OKUNO, MASAHISA; KAKUDA, TOORU; TATENO, HIDETO; JODA, TAKUYA
To: HITACHI KOKUSAI ELECTRIC INC.; AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
Reel/Frame 035623/0972 →
Assignment of Assignor's Interest
Oct 19, 2016
From: SUGIURA, SHINOBU; KUWATA, YOSUKE; MIYASHITA, TOMOYASU; UMEKAWA, ATSUSHI
To: HITACHI KOKUSAI ELECTRIC INC.; TOKYO TECHNOLOGICAL LABO CO., LTD.
Reel/Frame 040066/0259 →
Change of Address
Jan 12, 2017
From: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L.
To: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L.
Reel/Frame 041345/0585 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Change of Name
Apr 1, 2019
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048756/0699 →
Merger
Jul 27, 2020
From: RIDGEFIELD ACQUISITION
To: AZ ELECTRONIC MATERIALS S.À R.L.
Reel/Frame 053323/0591 →
Merger
Jul 27, 2020
From: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L.
To: RIDGEFIELD ACQUISITION
Reel/Frame 053324/0198 →
Assignment of Assignor's Interest
Jul 27, 2020
From: AZ ELECTRONIC MATERIALS GMBH
To: MERCK PATENT GMBH
Reel/Frame 053323/0770 →
Change of Legal Entity
Jul 27, 2020
From: AZ ELECTRONIC MATERIALS S.À R.L.
To: AZ ELECTRONIC MATERIALS GMBH
Reel/Frame 053323/0760 →