Patent Assignment
Reel/Frame 053323/0760
Change of Legal Entity
Recorded: 2020-07-27
Pages: 10
Assignor
AZ ELECTRONIC MATERIALS S.À R.L.
Executed: 2019-11-20
Assignee
AZ ELECTRONIC MATERIALS GMBH
FRANKFURTER STRASSE, DARMSTADT, 250 64293, GERMANY
Covered Properties
(94)
Thermally Stable, Moisture Curable Polysilazanes and Polysiloxazanes
Process Solutions Containing Surfactants
Process Solutions Containing Surfactants
Process Solutions Containing Surfactants
Coatings Containing Polysilazanes for Metal and Polymer Surfaces
Color-Pigmented Paint Composition Having High Covering Powder, Increased Scratch Resistance, and Easy-to-Clean Properties
Compositions of Neutral Layer for Directed Self Assembly Block Copolymers and Processes Thereof
Low Dielectric Photoimageable Compositions and Electronic Devices Made Therefrom
Methods and Materials for Removing Metals in Block Copolymers
Neutral Layer Polymer Composition for Directed Self Assembly and Processes Thereof
Positive Photosensitive Material
Negative-Working Thick Film Photoresist
Antireflective Compositions and Methods of Using Same
Antireflective Coating Composition and Process Thereof
Developable Bottom Anti-Reflective Coating
Positive Working Photosensitive Material
Stable Metal Compounds, Their Compositions and Methods
Template for Self Assembly and Method of Making a Self Assembled Pattern
Antireflective Coating Composition and Process Thereof
Spin-On Compositions of Soluble Metal Oxide Carboxylates and Methods of Their Use
Stable Metal Compounds as Hardmasks and Filling Materials, Their Compositions and Methods of Use
Underlayer Composition for Promoting Self Assembly and Method of Making and Using
Underlayer Composition for Promoting Self Assembly and Method of Making and Using
Spin Coatable Metallic Hard Mask Compositions and Processes Thereof
Methods and Materials for Removing Metals in Block Copolymers
Compositions of Neutral Layer for Directed Self Assembly Block Copolymers and Processes Thereof
Antireflective Coating Compositions and Processes Thereof
Negative-Working Photosensitive Siloxane Composition
Negative-Working Photosensitive Siloxane Composition
Method for Forming Dense Silicic Film
Aromatic Imide Compound and Method for Producing Same
Positive-Type Photosensitive Siloxane Composition
Method for Forming of Siliceous Film and Siliceous Film Formed Using Same
Polyoxometalate and Heteropolyoxometalate Compositions and Methods for Their Use
Composition for Forming Resist Underlayer
Silicon Containing Block Copolymers for Direct Self-Assembly Application
Composition for Forming Topcoat Layer and Resist Pattern Formation Method Employing the Same
Metal Hardmask Composition and Processes for Forming Fine Patterns on Semiconductor Substrates
Composite of Metal Oxide Nanoparticles and Silsesquioxane Polymer, Method for Producing Same, and Composite Material Produced Using Composite Thereof
Composition for Forming Overlay Film, and Resist Pattern Formation Method Employing the Same
Composite of Silicon Oxide Nanoparticles and Silsesquioxane Polymer, Method for Producing Same, and Composite Material Produced Using Composite Thereof
Substrate Processing Method, Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-Transitory Computer-Readable Recording Medium
Fine Resist Pattern-Forming Composition and Pattern Forming Method Using Same
Composition for Forming Fine Resist Pattern, and Pattern Formation Method Using Same
Composition for Forming Topcoat Layer and Resist Pattern Formation Method Employing the Same
Rinsing Liquid for Lithography and Pattern Forming Method Using Same
Photoresist Composition and Method of Manufacturing Substrate for Display Device by Using the Same
Novel Compositions and Processes for Self-Assembly of Block Copolymers
Patent:
9,574,104 →
Application:
14/885,328 →
Film-Forming Composition and Film-Forming Method Using Same
Novel Compositions and Use Thereof for Modification of Substrate Surfaces
Negative-Working Photoresist Compositions for Laser Ablation and Use Thereof
Application:
14/976,498 →
Publication:
US 2017/0176856
Materials Containing Metal Oxides, Processes for Making Same, and Processes for Using Same
Silicon-Containing Heat- or Photo-Curable Composition
Perhydropolysilazane, Composition Containing Same, and Method for Forming Silica Film Using Same
Copolymerized Polysilazane, Manufacturing Method Therefor, Composition Comprising Same, and Method for Forming Siliceous Film Using Same
Top-Layer Membrane Formation Composition and Method for Forming Resist Pattern Using Same
Hybrid Material for Use as Coating Means in Optoelectronic Components
Composition for Resist Patterning and Method for Forming Pattern Using Same
Positive Type Photosensitive Siloxane Composition, Active Matrix Substrate, Display Apparatus, and Method of Manufacturing Active Matrix Substrate
Composition for Forming Underlayer and Method for Forming Underlayer Therewith
A Photosensitive Composition and Color Converting Film
Compositions and Methods That Promote Charge Complexing Copper Protection During Low Pka Driven Polymer Stripping
Composition for Forming Coating Film and Method for Forming Coating Film Using Same
Optical Functional Film and Method for Producing the Same
Inorganic Polysilazane Resin
Negative-Working Photoresist Compositions for Laser Ablation and Use Thereof
A Photosensitive Composition and Color Converting Film
Method for Producing Silazane-Siloxane Copolymers and the Use of Such Copolymers
High Heat Resistance Resist Composition and Pattern Forming Method Using the Same
Composition for Forming Fine Resist Pattern and Pattern Forming Method Using Same
Negative Type Photosensitive Composition Curable at Low Temperature
Silazane-Siloxane Random Copolymers, Their Production and Use
Positive Type Photosensitive Siloxane Composition
Positive Working Photosensitive Material
Composition for Forming Fine Pattern and Method for Forming Fine Pattern Using the Same
Photosensitive Siloxane Composition
Negative Type Photosensitive Composition Curable at Low Temperature
Gap Filling Composition and Pattern Forming Method Using Low Molecular Weight Compound
Composition for Forming Dense Siliceous Film
Gap Filling Composition and Pattern Forming Method Using Composition Containing Polymer
A Rinse Composition, a Method for Forming Resist Patterns and a Method for Making Semiconductor Devices
Formulation for an Led Encapsulation Material
Formulation for Led Encapsulation Material
Enviromentally Stable, Thick Film, Chemically Amplified Resist
Polymer Compositions for Self-Assembly Applications
Bottom Antireflective Coating Forming Composition
Composition for Black Matrix and Method for Producing Black Matrix Using the Same
Chemically Amplified Positive Photoresist Composition and Pattern Forming Method Using Same
Siloxazane Compound and Composition Comprising the Same, and Method for Producing Silceous Film Using the Same
A Lithography Composition, a Method for Forming Resist Patterns and a Method for Making Semiconductor Devices
Black Matrix Composition, Blck Matrix, and Black Matrix Production Method
Novel Compositions and Processes for Self-Assembly of Block Copolymers
Composition of Spin-on Materials Containing Metal Oxide Nanoparticles and an Organic Polymer
Photosensitive Siloxane Composition
Application:
16/806,481 →
Publication:
US 2020/0201179
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 8, 2009
From: BRAND, STEFAN; DIERDORF, ANDREAS; LIEBE, HUBERT; OSTEROD, FRANK
To: CLARIANT INTERNATIONAL, LTD.
Reel/Frame 023618/0957 →
Assignment of Assignor's Interest
May 10, 2012
From: AIR PRODUCTS AND CHEMICALS, INC.
To: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
Reel/Frame 028191/0393 →
Assignment of Assignor's Interest
May 17, 2012
From: YIN, JIAN; WU, HENGPENG; THIYAGARAJAN, MUTHIAH; HONG, SUNGEUN
To: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
Reel/Frame 028224/0060 →
Assignment of Assignor's Interest
May 31, 2012
From: WU, HENGPENG; CAO, YI; HONG, SUNGEUN; YIN, JIAN
To: AZ ELECTRONIC MATERIALS USA CORP.
Reel/Frame 028315/0234 →
Assignment of Assignor's Interest
Jul 26, 2012
From: CLARIANT FINANCE (BVI) LIMITED
To: AZ ELECTRONIC MATERIALS (LEXEMBOURG) S.A.R.L.
Reel/Frame 028642/0290 →
Address Change
Jan 23, 2013
From: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
To: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
Reel/Frame 029675/0068 →
Assignment of Assignor's Interest
Oct 8, 2013
From: YAO, HUIRONG; RAHMAN, M. DALIL; MULLEN, SALEM K.; CHO, JOONYEON
To: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
Reel/Frame 031365/0186 →
Assignment of Assignor's Interest
Oct 8, 2013
From: LIU, WEIHONG; LU, PING-HUNG; TOUKHY, MEDHAT; LAI, SOOKMEE
To: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
Reel/Frame 031365/0086 →
Assignment of Assignor's Interest
Feb 12, 2014
From: AZ ELECTRONIC MATERIALS USA CORP.
To: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
Reel/Frame 032205/0673 →
Assignment of Assignor's Interest
Apr 16, 2014
From: ZHANG, RUZHI; KIM, JIHOON; PATEL, BHARATKUMAR K.; WOLFER, ELIZABETH
To: AZ ELECTRONIC MATERIALS USA CORP.
Reel/Frame 032688/0648 →
Assignment of Assignor's Interest
Apr 23, 2014
From: AZ ELECTRONIC MATERIALS USA CORP.
To: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
Reel/Frame 032736/0422 →
Change of Address
Jul 15, 2014
From: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
To: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
Reel/Frame 033329/0264 →
Assignment of Assignor's Interest
Aug 22, 2014
From: RAHMAN, M. DALIL; ANYADIEGWU, CLEMENT; MCKENZIE, DOUGLAS; CHO, JOONYEON
To: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
Reel/Frame 033594/0156 →
Assignment of Assignor's Interest
Aug 22, 2014
From: YAO, HUIRONG; LIN, GUANYANG; CHO, JOONYEON
To: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
Reel/Frame 033593/0989 →
Change of Address
Jan 12, 2017
From: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L.
To: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L.
Reel/Frame 041345/0585 →
Assignment of Assignor's Interest
Feb 20, 2017
From: AIR PRODUCTS AND CHEMICALS, INC.
To: VERSUM MATERIALS US, LLC
Reel/Frame 041772/0733 →
Merger
Jul 27, 2020
From: RIDGEFIELD ACQUISITION
To: AZ ELECTRONIC MATERIALS S.À R.L.
Reel/Frame 053323/0591 →
Merger
Jul 27, 2020
From: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L.
To: RIDGEFIELD ACQUISITION
Reel/Frame 053324/0198 →
Assignment of Assignor's Interest
Jul 27, 2020
From: AZ ELECTRONIC MATERIALS GMBH
To: MERCK PATENT GMBH
Reel/Frame 053323/0770 →