Compositions of neutral layer for directed self assembly block copolymers and processes thereof

1. A neutral layer composition capable upon heating of forming a crosslinked random copolymer neutral layer for directed self assembly of a block copolymer coated on top of the crosslinked neutral layer wherein the neutral layer composition comprises;

(i) at least one random copolymer of structure (I) having at least one unit of structure (1), at least one unit of structure (2) and at least one unit of structure (3)

where R 1 is selected from the group consisting of a C 1 -C 8 alkyl, C 1 -C 8 fluoroalkyl, C 1 -C 8 partially fluorinated alkyl moiety, C 4 -C 8 cycloalkyl, C 4 -C 8 cyclofluoroalkyl, C 4 -C 8 partially fluorinated cycloalkyl, and a C 2 -C 8 hydroxyalkyl; R 2 , R 3 and R 5 are independently selected from a group consisting of H, C 1 -C 4 alkyl, CF 3 and F; R 4 is selected from the group consisting of H, C 1 -C 8 alkyl, C 1 -C 8 partially fluorinated alkyl moiety and C 1 -C 8 fluoroalkyl, n ranges from 1 to 5, R 6 is selected from the group consisting of H, F, C 1 -C 8 alkyl and a C 1 -C 8 fluoroalkyl and m ranges from 1 to 3, and

wherein the neutral layer has unit 1 ranging from about 20 mole % to about 80 mole %; unit 2 ranging from about 20 mole % to about 80 mole % and unit 3 ranging from about 15 mole % to about 45 mole %, and

ii) a solvent.

2. The composition of claim 1 , wherein the random copolymer is capable of forming a crosslinked neutral layer when coated and heated on a substrate.

3. The composition of claim 1 , wherein the random copolymer is capable of forming a crosslinked neutral layer which when coated and heated on a substrate is not soluble in an organic solvent for photoresist.

4. The composition of claim 1 , wherein the random copolymer is capable of forming a crosslinked neutral layer which is not soluble in an aqueous alkaline developer when coated and heated on a substrate.

5. The composition of claim 1 , wherein the block copolymer to be self-assembled on the neutral layer random copolymer of structure (I) comprises at least two blocks of monomeric units with different etch rates.

6. The composition of claim 1 , where R 1 is selected from the group consisting of a C 1 -C 8 alkyl; R 2 , R 3 and R 5 are independently selected from the group consisting of H and C 1 -C 4 alkyl; R 4 is selected from the group consisting of H, C 1 -C 8 alkyl, and n=1; and R 6 is selected from the group consisting of H, C 1 -C 8 alkyl and m=1.

7. The composition of claim 1 , wherein the composition comprises a blend of random copolymer of structure (I).

8. The composition of claim 1 , wherein the block copolymer to be self assembled on the neutral layer random copolymer of structure (I) is poly(styrene-b-methylmethacrylate).

9. A process for forming an image by graphoepitaxy comprising:

a) forming a coating of the neutral layer from claim 1 on a substrate;

b) heating the neutral layer to form a crosslinked neutral layer;

c) providing a coating of a photoresist layer over the crosslinked neutral layer;

d) forming a pattern in the photoresist;

e) applying a block copolymer comprising an etch resistant block and highly etchable block over the photoresist pattern and annealing until directed self assembly occurs; and,

f) etching the block copolymer, thereby removing the highly etchable block of the copolymer and forming a pattern.

10. The process of claim 9 wherein the photoresist pattern is formed by imaging lithography selected from a group consisting of e-beam, broadband, 193 nm immersion lithography, 13.5 nm, 193nm, 248 nm, 365 nm and 436 nm.

11. The process of claim 9 , wherein the photoresist is positive or negative.

12. The process for forming an image by chemoepitaxy comprising:

a) forming a coating of a neutral layer from claim 1 on a substrate;

b) heating the neutral layer to form a crosslinked neutral layer;

c) providing a coating of a photoresist layer over the crosslinked neutral layer;

d) forming a pattern in the photoresist layer to remove the unexposed photoresist, thereby forming an uncovered crosslinked neutral layer region;

e) treating the uncovered crosslinked neutral layer region,

f) removing the photoresist,

g) applying a block copolymer comprising an etch resistant block and highly etchable block over the neutral layer and annealing until directed self assembly occurs; and,

h) etching the block copolymer, thereby removing the highly etchable block of the copolymer and forming a pattern.

13. The process of claim 12 , wherein the photoresist pattern is formed by imaging lithography selected from a group consisting of e-beam, 193 nm immersion lithography, broadband, 13.5 nm, 193 nm, 248 nm, 365 nm and 436 nm.

14. The process of claim 12 , wherein the photoresist is a negative or positive photoresist.

15. A process for forming an image by chemoepitaxy comprising:

a) forming a coating of neutral layer from claim 1 on a substrate;

b) heating the neutral layer to form a crosslinked neutral layer;

c) providing a coating of a photoresist layer over the crosslinked neutral layer;

d) forming a pattern in the photoresist layer;

e) applying a block copolymer comprising an etch resistant block and highly etchable block over the photoresist pattern and annealing until directed self assembly occurs; and,

f) etching the block copolymer with a plasma, thereby removing the highly etchable block of the copolymer and forming a pattern.

16. The process of claim 15 , wherein the photoresist pattern is formed by imaging lithography selected from a group consisting of e-beam, broadband, 193 nm immersion lithography, 13.5 nm, 193 nm, 248 nm, 365 nm and 436 nm.

17. The process of claim 15 , where the photoresist is a negative or positive photoresist.

18. The composition of claim 1 where the solvent is selected from the group consisting of ethyl cellosolve, methyl cellosolve, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, dipropylene glycol dimethyl ether, propylene glycol n-propyl ether, diethylene glycol dimethyl ether; ethyl cellosolve acetate, methyl cellosolve acetate, propylene glycol monomethyl ether acetate; ethyl acetate, n-butyl acetate, amyl acetate; ethylene glycol diacetate, propylene glycol diacetate, methyl lactate, ethyl lactate, ethyl glycolate, ethyl-3-hydroxy propionate, methyl pyruvate, ethyl pyruvate, ethyl 3-ethoxypropionate, ethyl 2-hydroxy-2-methylpropionate, methylethoxypropionate, methyl ethyl ketone, acetyl acetone, cyclopentanone, cyclohexanone, 2-heptanone, diacetone alcohol methyl ether, acetol, diacetone alcohol; 1,3 dioxalane diethoxypropane, butyrolactone, dimethylacetamide, dimethylformamide, anisole, and mixtures thereof.

19. The composition of claim 5 wherein the block of monomeric units comprising different etch rates is derived from monomers comprising oxygen and which do not contain refractory elements, and wherein the other block is derived from monomers rich in carbon or ones containing the refractory elements Si, Ge or Ti.

20. The composition of claim 5 , wherein one of the blocks of monomeric units is selected; from the group consisting of methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, n-pentyl (meth)acrylate, isopentyl (meth)acrylate, neopentyl (meth)acrylate, n-hexyl (meth)acrylate, cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, hydroxyethyl (meth)acrylate and mixtures thereof and the other block is selected from the group consisting of ethylene, propylene, 1-butene, 1,3-butadiene, isoprene, dihydropyran, norbornene, maleic anhydride, styrene, 4-hydroxy styrene, 4-acetoxy styrene, 4-methylstyrene, alpha-methylstyrene and mixtures thereof.