Method for forming of siliceous film and siliceous film formed using same
View Patent ↗A siliceous film having high purity and a low etching rate is formed by (a) a step for forming a siliceous film on a substrate by coating a solution composed of a polysilazane, e.g., perhydropolysilazane on a substrate and then hardening (curing) the solution in an oxidizing atmosphere, or by coating a silica solution formed by a sol-gel method on a substrate, and (b) a step for heating the siliceous film in an inert gas environment containing a nitrogen-containing compound such as an alkylamine having a base dissociation constant (pKb) no greater than 4.5, or a halogen-containing compound in which the bond energy of a halogen atom such as F 2 , Br 2 , or NF 3 is no greater than 60 kcal/mol, in order to anneal the film.
1. A method for forming a siliceous film-comprising the steps of
(a) forming a siliceous film on a substrate by applying a polysilazane solution on the substrate and curing it in an oxidation atmosphere; and
(b) heating and annealing the siliceous film in an inert atmosphere containing a halogen-containing compound having the binding energy of a halogen atom of 60 kcal/mol or less,
wherein the halogen-containing compound having the binding energy of a halogen atom of 60 kcal/mol or less is Br 2 , F 2 or NF 3 and the polysilazane is perhydropolysilazanes and the cure is performed at 200 to 500° C. in a water vapor atmosphere.
2. A method for forming a trench isolation structure, wherein a substrate has a groove for forming a trench isolation structure and the groove is buried and sealed by the method for forming a siliceous film according to claim 1 .
3. A method for forming a siliceous film comprising the steps of
(a) forming a siliceous film on a substrate by applying a polysilazane solution on the substrate and curing it in an oxidation atmosphere; and
(b) heating and annealing the siliceous film in an inert atmosphere containing a halogen-containing compound having the binding energy of a halogen atom of 60 kcal/mol or less,
wherein the halogen-containing compound having the binding energy of a halogen atom of 60 kcal/mol or less is Br 2 , F 2 or NF 3 , the annealing is performed at 200 to 500 ° C. in a dry atmosphere, the polysilazane is perhydropolysilazanes and the cure is performed at 200 to 500° C. in a water vapor atmosphere.
4. A method for forming a trench isolation structure, wherein a substrate has a groove for forming a trench isolation structure and the groove is buried and sealed by the method for forming a siliceous film according to claim 3 .