Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
View Patent ↗A method of manufacturing a semiconductor device including forming a thin film containing silicon, oxygen and carbon on a substrate by performing a cycle a predetermined number of times, the cycle including: supplying a precursor gas containing silicon, carbon and a halogen element and having an Si—C bonding, and a first catalytic gas to the substrate; and supplying an oxidizing gas and a second catalytic gas to the substrate.
1. A method of manufacturing a semiconductor device, comprising forming a thin film containing silicon, oxygen and carbon on a substrate by performing a cycle a predetermined number of times, the cycle comprising:
supplying a precursor gas containing silicon, carbon and a halogen element and having an Si—C bonding, together with a first catalytic gas to the substrate, the first catalytic gas containing N having lone pair electrons; and
supplying an oxidizing gas together with a second catalytic gas to the substrate, the second catalytic gas containing N having lone pair electrons,
wherein a carbon concentration in the thin film is controlled by adjusting at least one of a supply amount of the second catalytic gas, a ratio of a flow rate of the second catalytic gas to a sum of flow rates of the oxidizing gas and the second catalytic gas, and a partial pressure of the second catalytic gas in the act of supplying the oxidizing gas together with the second catalytic gas.
2. The method of claim 1 , wherein each of the act of supplying the precursor gas and the first catalytic gas and the act of supplying the oxidizing gas and the second catalytic gas is performed under a non-plasma atmosphere.
3. The method of claim 1 , wherein, in the act of forming the thin film, the cycle is performed a plurality number of times, and
a carbon concentration in the thin film is changed in a film thickness direction by changing a supply amount of the second catalytic gas supplied in the act of supplying the oxidizing gas and the second catalytic gas, while the cycle is performed the plurality number of times.
4. The method of claim 1 , wherein, in the act of forming the thin film, the cycle is performed a plurality number of times, and
a carbon concentration in the thin film is changed in a film thickness direction by changing a type of the second catalytic gas supplied in the act of supplying the oxidizing gas and the second catalytic gas, while the cycle is performed the plurality number of times.
5. The method of claim 1 , wherein, in the act of forming the thin film, the cycle is performed a plurality number of times, and
a carbon concentration in the thin film is changed in a film thickness direction by changing a type of the precursor gas supplied in the act of supplying the precursor gas and the first catalytic gas, while the cycle is performed the plurality number of times.
6. The method of claim 1 , wherein, in the act of supplying the precursor gas and the first catalytic gas and the act of supplying the oxidizing gas and the second catalytic gas, the first and second catalytic gases being the same type are supplied in different supply amounts, respectively.
7. The method of claim 1 , wherein, in the act of supplying the precursor gas and the first catalytic gas and the act of supplying the oxidizing gas and the second catalytic gas, the first and second catalytic gases being different types are supplied, respectively.
8. The method of claim 1 , wherein the precursor gas contains at least one selected from the group consisting of an alkyl group and an alkylene group.
9. The method of claim 1 , wherein the precursor gas contains at least one selected from the group consisting of an Si—C—Si bonding and an Si—C—C—Si bonding.
10. The method of claim 1 , wherein each of the first and second catalytic gases comprises an amine-based gas.
11. The method of claim 1 , wherein, in each of the act of supplying the precursor gas and the first catalytic gas and the act of supplying the oxidizing gas and the second catalytic gas, a temperature of the substrate ranges from room temperature to 200 degrees C.
12. The method of claim 1 , wherein each of the first catalytic gas and the second catalytic gas has an acid dissociation constant ranging from about 5 to 11.
13. The method of claim 1 , wherein each of the first catalytic gas and the second catalytic gas includes at least one selected from the group consisting of pyridine, aminopyridine, picoline, lutidine, piperazine, piperidine, triethylamine, diethylamine, monoethylamine, trimethylamine and monomethylamine.
14. The method of claim 1 , wherein each of the first catalytic gas and the second catalytic gas includes a cyclic amine-based gas.
15. The method of claim 1 , wherein each of the first catalytic gas and the second catalytic gas includes at least one selected from the group consisting of pyridine, aminopyridine, picoline, lutidine, piperazine and piperidine.
16. The method of claim 1 , wherein the first catalytic gas weakens bonding strength of O—H bonding which exists on a surface of the substrate before supplying the precursor gas and the first catalytic gas, and
wherein the second catalytic gas weakens bonding strength of O—H bonding included in the oxidizing gas.