IP Library › Assignment 048756/0699
Patent Assignment
Reel/Frame 048756/0699

Change of Name

Recorded: 2019-04-01 Pages: 5
Assignor
HITACHI KOKUSAI ELECTRIC INC.
Executed: 2000-10-01
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Properties (19)
Semiconductor Wafer Processing Apparatus for Transferring a Wafer Mount
Patent: 6,462,411 →
Application: 09/205,299 →
Treatment Object Conveyor Apparatus, Semiconductor Manufacturing Apparatus, and Treatment Object Treatment Method
Patent: 6,190,104 →
Application: 09/326,673 →
Substrate Processing Apparatus
Patent: 6,485,604 →
Application: 09/391,062 →
Method for Producing a Semiconductor Device
Patent: 6,204,199 →
Application: 09/393,276 →
Semiconductor Producing Apparatus and Temperature Control Method Therefor
Patent: 6,496,749 →
Application: 09/413,467 →
Substrate Processing Apparatus and Substrate Processing Method
Patent: 6,582,174 →
Application: 09/491,491 →
Substrate processing apparatus and substrate processing method
Patent: 6,251,189 →
Application: 09/502,219 →
Semiconductor Manufacturing Method and Semiconductor Manufacturing Apparatus
Patent: 6,368,049 →
Application: 09/544,463 →
Manufacturing Method for Semiconductor Device and Semiconductor Manufacturing Apparatus
Patent: 6,573,178 →
Application: 09/556,160 →
Semiconductor Device Manufacturing Method and Semiconductor Manufacturing Apparatus
Patent: 6,486,083 →
Application: 09/675,192 →
Method for Manufacturing Semiconductor Device, Substrate Treatment Method, and Semiconductor Manufacturing Apparatus
Patent: 6,821,871 →
Application: 09/879,122 →
Publication: US 2002/0016051
Semiconductor Device Manufacturing Method and Semiconductor Manufacturing Apparatus
Patent: 6,716,772 →
Application: 10/223,981 →
Publication: US 2002/0197890
Plasma Generator, Ozone Generator, Substrate Processing Apparatus and Manufacturing Method of Semiconductor Device
Patent: 7,514,377 →
Application: 10/539,569 →
Publication: US 2006/0189168
Substrate Processing Apparatus
Patent: 8,482,426 →
Application: 12/805,889 →
Publication: US 2011/0012745
Method of Manufacturing a Semiconductor Device, Substrate Processing Apparatus and Recording Medium
Patent: 9,396,929 →
Application: 14/021,549 →
Publication: US 2014/0080318
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Patent: 9,548,198 →
Application: 14/218,484 →
Publication: US 2014/0287596
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Patent: 9,343,290 →
Application: 14/219,474 →
Publication: US 2014/0287598
Substrate Processing Method, Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-Transitory Computer-Readable Recording Medium
Patent: 9,502,239 →
Application: 14/707,350 →
Publication: US 2015/0262817
Heating Part, Substrate Processing Apparatus, and Method of Manufacturing Semiconductor Device
Application: 15/272,798 →
Publication: US 2017/0107620
Related Assignments (14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 11, 2013
From: HIROSE, YOSHIRO; MIZUNO, NORIKAZU
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 031463/0366 →
Assignment of Assignor's Interest Oct 11, 2013
From: YANAGITA, KAZUTAKA; HIGASHINO, KATSUKO
To: L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE
Reel/Frame 031463/0233 →
Assignment of Assignor's Interest Jul 29, 2014
From: HIROSE, YOSHIRO; MIZUNO, NORIKAZU; YANAGITA, KAZUTAKA; OKUBO, SHINGO
To: HITACHI KOKUSAI ELECTRIC INC.; L'AIR LIQUIDE SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE
Reel/Frame 033413/0460 →
Assignment of Assignor's Interest Sep 11, 2014
From: HIROSE, YOSHIRO; MIZUNO, NORIKAZU; YANAGITA, KAZUTAKA; OKUBO, SHINGO
To: HITACHI KOKUSAI ELECTRIC INC.; L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE
Reel/Frame 033721/0853 →
Assignment of Assignor's Interest Mar 25, 2015
From: HITACHI, LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 035249/0082 →
Assignment of Assignor's Interest May 8, 2015
From: OKUNO, MASAHISA; KAKUDA, TOORU; TATENO, HIDETO; JODA, TAKUYA
To: HITACHI KOKUSAI ELECTRIC INC.; AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
Reel/Frame 035623/0972 →
Assignment of Assignor's Interest Oct 19, 2016
From: SUGIURA, SHINOBU; KUWATA, YOSUKE; MIYASHITA, TOMOYASU; UMEKAWA, ATSUSHI
To: HITACHI KOKUSAI ELECTRIC INC.; TOKYO TECHNOLOGICAL LABO CO., LTD.
Reel/Frame 040066/0259 →
Change of Address Jan 12, 2017
From: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L.
To: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L.
Reel/Frame 041345/0585 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Assignment of Assignor's Interest Apr 25, 2019
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 049008/0028 →
Merger Jul 27, 2020
From: RIDGEFIELD ACQUISITION
To: AZ ELECTRONIC MATERIALS S.À R.L.
Reel/Frame 053323/0591 →
Merger Jul 27, 2020
From: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.À R.L.
To: RIDGEFIELD ACQUISITION
Reel/Frame 053324/0198 →
Assignment of Assignor's Interest Jul 27, 2020
From: AZ ELECTRONIC MATERIALS GMBH
To: MERCK PATENT GMBH
Reel/Frame 053323/0770 →
Change of Legal Entity Jul 27, 2020
From: AZ ELECTRONIC MATERIALS S.À R.L.
To: AZ ELECTRONIC MATERIALS GMBH
Reel/Frame 053323/0760 →