Patent Assignment
Reel/Frame 040070/0688
Assignment of Assignor's Interest
Recorded: 2016-10-20
Pages: 7
Assignors
RYU, SEUNG-MIN
Executed: 2016-07-12
KOIDE, TAKANORI
Executed: 2016-07-08
YAMADA, NAOKI
Executed: 2016-07-08
LIM, JAE-SOON
Executed: 2016-07-12
SHIRATORI, TSUBASA
Executed: 2016-07-08
CHO, YOUN-JOUNG
Executed: 2016-07-18
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
ADEKA CORPORATION
2-35, HIGASHIOGU 7-CHOME, ARAKAWA-KU, TOKYO, JAPAN
Covered Property
(1)
Tantalum Compound and Methods of Forming Thin Film and Fabricating Integrated Circuit Device by Using the Same