Tantalum compound and methods of forming thin film and fabricating integrated circuit device by using the same

1. A method of fabricating an integrated circuit device, the method comprising:

forming a lower structure on a substrate; and

forming a tantalum-containing film on the lower structure by using a tantalum compound represented by the following General Formula (I):

wherein, in General Formula I,

R 1 , R 3 , and R 4 are each independently a C1 to C10 substituted or unsubstituted linear or branched alkyl, alkenyl, or alkynyl group, or a C4 to C20 substituted or unsubstituted aromatic or alicyclic hydrocarbon group; and

R 2 is a hydrogen atom, a C1 to C10 substituted or unsubstituted linear or branched alkyl, alkenyl, or alkynyl group, or a C6 to C20 substituted or unsubstituted aromatic or alicyclic hydrocarbon group.

2. The method as claimed in claim 1 , wherein the tantalum compound is a liquid at 25° C. and 1 atm.

3. The method as claimed in claim 1 , further comprising forming a capacitor on the substrate such that the capacitor includes a lower electrode, a dielectric film, and an upper electrode,

wherein:

forming the lower structure includes forming the lower electrode of the capacitor on the substrate, and

forming the tantalum-containing film includes forming a tantalum oxide film that covers a surface of the lower electrode.

4. The method as claimed in claim 3 , wherein:

forming the lower electrode includes forming a mold pattern on the substrate such that the mold pattern includes a hole exposing a conductive region of the substrate; and forming the lower electrode such that the lower electrode has a sidewall extending along an inner wall of the hole, and

forming the tantalum oxide film includes exposing the sidewall of the lower electrode by removing the mold pattern; and forming a Ta 2 O 5 film that covers the exposed sidewall of the lower electrode.

5. The method as claimed in claim 3 , wherein forming the capacitor includes forming a high-K dielectric film that includes a combination of the tantalum-containing film and at least one metal oxide film including a metal that is different from tantalum.

6. The method as claimed in claim 1 , wherein:

forming the lower structure includes forming a plurality of fin-shaped active regions that protrude upwardly from the substrate by etching a portion of the substrate; and forming a high-K dielectric film on the plurality of fin-shaped active regions, and

forming the tantalum-containing film includes forming a tantalum nitride film on the high-K dielectric film on the plurality of fin-shaped active regions.

7. The method as claimed in claim 6 , wherein forming the tantalum nitride film includes:

forming a tantalum compound-adsorbed layer on the high-K dielectric film by supplying the tantalum compound represented by General Formula (I) onto the high-K dielectric film; and

reacting the tantalum compound-adsorbed layer with a nitrogen atom-containing reactive gas by supplying the reactive gas onto the tantalum compound-adsorbed layer.

8. The method as claimed in claim 6 , wherein forming the tantalum nitride film includes supplying the tantalum compound represented by General Formula (I) and a nitrogen atom-containing reactive gas onto the high-K dielectric film.

9. The method as claimed in claim 6 , further comprising forming a metal-containing gate layer on the tantalum nitride film on the plurality of fin-shaped active regions, after forming the tantalum nitride film, wherein forming the metal-containing gate layer includes:

forming a first metal-containing film on the tantalum nitride film on the plurality of fin-shaped active regions, the first metal-containing film including a metal that is different from tantalum;

exposing a portion of the tantalum-containing film by etching a portion of the first metal-containing film on a portion of the plurality of fin-shaped active regions and using the tantalum nitride film as an etch stop layer;

cleaning an exposed surface of the tantalum nitride film and an upper surface of the first metal-containing film; and

forming a second metal-containing film that covers the exposed surface of the tantalum nitride film and the upper surface of the first metal-containing film.

10. The method as claimed in claim 9 , wherein exposing the portion of the tantalum-containing film by etching the portion of the first metal-containing film includes exposing the portion of the tantalum-containing film by etching the portion of the first metal-containing film with an etch solution that includes H 2 O 2 .