IP Library › Granted Patent US 12,473,309
Granted Patent B2
US 12,473,309 · App. 17/346,400 · Granted Nov 18, 2025

Organometallic compound and method of manufacturing integrated circuit using the same

Inventors: Seungmin Ryu (Hwaseong-si, KR); Younsoo Kim (Yongin-si, KR); Gyuhee Park (Hwaseong-si, KR); Younjoung Cho (Hwaseong-si, KR); Yutaro Aoki (Tokyo, JP); Wakana Fuse (Tokyo, JP); Kazuki Harano (Tokyo, JP); Takanori Koide (Tokyo, JP); Yoshiki Manabe (Tokyo, JP); Kazuya Saito (Tokyo, JP); Hiroyuki Uchiuzou (Tokyo, JP)
Assignee: ADEKA CORPORATION
C07F9/005C23C16/34C23C16/45536C23C16/45557H10K71/166H10K85/30
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,473,309
App. No.
17/346,400
Granted
Nov 18, 2025
Kind
B2
Abstract

An organometallic compound and a method of manufacturing an integrated circuit (IC) device, the organometallic compound being represented by Formula (I),

Claims (43)

1 . An organometallic compound represented by Formula (I),

wherein, in Formula (I), M is a tantalum atom; or a vanadium atom, R 1 is a C1-C5 straight-chain alkyl group or a C3-C5 branched alkyl group, R 2 and R 3 are each independently a C1-C8 straight-chain alkyl group or a C3-C8 branched alkyl group, at least one of R 2 and R 3 being substituted with at least six fluorine atom, R 4 is a C1-C10 straight-chain alkyl group or a C3-C10 branched alkyl group, and n is an integer of 0 to 5, and

wherein the organometallic compound is a liquid at a temperature of about 20° C. at an atmospheric pressure.

2 . The organometallic compound as claimed in claim 1 , wherein, in Formula (I),

n is 0 or 1, and

when n is 1, R 1 is a methyl group or an ethyl group.

3 . The organometallic compound as claimed in claim 1 ,

wherein, in Formula (I), R 2 and R 3 are each independently a C1-C8 straight-chain perfluoroalkyl group or a C3-C5 branched perfluoroalkyl group.

4 . The organometallic compound as claimed in claim 1 ,

wherein, in Formula (I), at least one of R 2 and R 3 is a C3-C5 branched perfluoroalkyl group.

5 . An organometallic compound represented by Formula (I),

wherein, in Formula (I), M is a niobium atom,

n is 0,

R 2 and R 3 are each independently a hexafluoroisopropyl group or a nonafluoro tert-butyl group, and

R 4 is a C1-C10 straight-chain alkyl group or a C3-C10 branched alkyl group, and

wherein the organometallic compound is a liquid at a temperature of about 20° C. at an atmospheric pressure.

6 . The organometallic compound as claimed in claim 1 ,

wherein, in Formula (I), R 4 is a C3-C8 branched alkyl group.

7 . The organometallic compound as claimed in claim 1 ,

wherein, in Formula (I), R 4 is an isopropyl group, a sec-butyl group, a tert-butyl group, a tert-pentyl group, or a tert-octyl group.

8 . The organometallic compound as claimed in claim 1 ,

wherein, in Formula (I), M is a tantalum atom.

9 . The organometallic compound as claimed in claim 1 ,

wherein, in Formula (I), M is a tantalum atom, R 1 is a methyl group or an ethyl group, R 2 and R 3 are each independently a C1-C8 straight-chain perfluoroalkyl group or a C3-C5 branched perfluoroalkyl group, R 4 is a C3-C8 branched alkyl group, and n is 0 or 1.

10 . A method of manufacturing an integrated circuit (IC) device, the method comprising forming a metal-containing film on a substrate by using an organometallic compound represented by Formula (I):

wherein, in Formula (I), M is a niobium atom, n is 0, R 2 and R 3 are each independently a hexafluoroisopropyl group or a nonafluoro tert-butyl group, and R 4 is a C1-C10 straight-chain alkyl group or a C3-C10 branched alkyl group, and

wherein the organometallic compound is a liquid at a temperature of about 20° C. at an atmospheric pressure.

11 . The method as claimed in claim 10 ,

wherein forming the metal-containing film includes:

supplying the organometallic compound of Formula (I) onto the substrate; and

supplying a reactive gas onto the substrate.

12 . The method as claimed in claim 11 ,

wherein the reactive gas includes a nitriding gas, the nitriding gas including NH 3 , N 2 plasma, an organic amine compound, a hydrazine compound, or a combination thereof.

13 . The method as claimed in claim 11 ,

wherein the reactive gas includes an oxidizing gas, the oxidizing gas including O 2 , O 3 , O 2 plasma, H 2 O, NO 2 , NO, nitrous oxide (N 2 O), CO, CO 2 , H 2 O 2 , HCOOH, CH 3 COOH, (CH 3 CO) 2 O, an alcohol, a peroxide, sulfur oxide, or a combination thereof.

14 . The organometallic compound as claimed in claim 5 ,

wherein, in Formula (I), R 4 is a C3-C8 branched alkyl group.

15 . The organometallic compound as claimed in claim 5 ,

wherein, in Formula (I), R 4 is an isopropyl group, a sec-butyl group, a tert-butyl group, a tert-pentyl group, or a tert-octyl group.

16 . The method as claimed in claim 10 ,

wherein, in Formula (I), R 4 is a C3-C8 branched alkyl group.

17 . The method as claimed in claim 10 ,

wherein, in Formula (I), R 4 is an isopropyl group, a sec-butyl group, a tert-butyl group, a tert-pentyl group, or a tert-octyl group.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2021
From: RYU, SEUNGMIN; KIM, YOUNSOO; PARK, GYUHEE; CHO, YOUNJOUNG; AOKI, YUTARO; FUSE, WAKANA; HARANO, KAZUKI; KOIDE, TAKANORI; MANABE, YOSHIKI; SAITO, KAZUYA; UCHIUZOU, HIROYUKI
To: SAMSUNG ELECTRONICS CO., LTD.; ADEKA CORPORATION
Reel/Frame 056558/0962 →
Priority Claims (2)
KR 10-2020-0073250 · Jun 16, 2020 · national
KR 10-2021-0021385 · Feb 17, 2021 · national
Continuity (1)
Related Publication 20210388010A1 · Dec 16, 2021
References Cited (24)
US 5840897A · Kirlin et al. · 1998 [cited by applicant]
US 6228426B1 · Lee et al. · 2001 [cited by applicant]
US 6485784B1 · Leedham et al. · 2002 [cited by applicant]
US 7514115B2 · Takashima · 2009 [cited by examiner]
US 7619093B2 · Meiere · 2009 [cited by applicant]
US 8460989B2 · Blasco et al. · 2013 [cited by applicant]
US 8470401B2 · Merle et al. · 2013 [cited by applicant]
US 8546276B2 · Gatineau et al. · 2013 [cited by applicant]
US 9828402B2 · Moon et al. · 2017 [cited by applicant]
US 10106887B2 · Lansalot-Matras et al. · 2018 [cited by applicant]
US 10134582B2 · Ryu et al. · 2018 [cited by applicant]
EP 1916253A1 · 2008 [cited by applicant]
JP 1995263442A · 1995 [cited by applicant]
JP 2000117072A · 2000 [cited by applicant]
JP 2007070236A · 2007 [cited by applicant]
JP 2010507729A · 2010 [cited by applicant]
KR 100349001B1 · 2002 [cited by applicant]
KR 1020090053423A · 2009 [cited by applicant]
KR 1020120042971A · 2012 [cited by applicant]
KR 1020130049020A · 2013 [cited by applicant]
KR 1020160113473A · 2016 [cited by applicant]
KR 1020170073947A · 2017 [cited by applicant]
V. Gibson, et al. 23 Dalton Transactions 4457-4465 (2003) (Year: 2003). [cited by examiner]
Korean Notice of Allowance dated Feb. 14, 2023. [cited by applicant]