Patent Assignment
Reel/Frame 056558/0962
Assignment of Assignor's Interest
Recorded: 2021-06-14
Pages: 9
Assignors
RYU, SEUNGMIN
Executed: 2021-05-25
KIM, YOUNSOO
Executed: 2021-05-25
PARK, GYUHEE
Executed: 2021-05-25
CHO, YOUNJOUNG
Executed: 2021-05-25
AOKI, YUTARO
Executed: 2021-05-21
FUSE, WAKANA
Executed: 2021-05-21
HARANO, KAZUKI
Executed: 2021-05-21
KOIDE, TAKANORI
Executed: 2021-05-21
MANABE, YOSHIKI
Executed: 2021-05-21
SAITO, KAZUYA
Executed: 2021-05-21
UCHIUZOU, HIROYUKI
Executed: 2021-05-21
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
ADEKA CORPORATION
2-35, HIGASHIOGU 7-CHOME,, ARAKAWA-KU, TOKYO,, JAPAN
Covered Property
(1)
Organometallic Compound and Method of Manufacturing Integrated Circuit Using the Same