Patent Assignment
Reel/Frame 040106/0860
Assignment of Assignor's Interest
Recorded: 2016-10-24
Pages: 3
Assignors
KAKUTANI, OSAMU
Executed: 2016-09-01
KOBAYASHI, TAITO
Executed: 2016-09-01
SATO, YASUSHI
Executed: 2016-09-02
Assignee
SHINKAWA LTD.
51-1 INADAIRA 2-CHOME,, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Bonding Apparatus and Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.