Patent Assignment
Reel/Frame 040194/0705
Assignment of Assignor's Interest
Recorded: 2016-11-02
Pages: 6
Assignors
YAMAUCHI, KAZUTO
Executed: 2016-09-15
ISOHASHI, AI
Executed: 2016-09-15
SANO, YASUHISA
Executed: 2016-09-15
Assignees
OSAKA UNIVERSITY
1-1, YAMADAOKA, SUITA-SHI, OSAKA, 565-0871, JAPAN
TOHO ENGINEERING CO., LTD
443 AZA KAWANOSHITA, YAMAKE-CHO, YOKKAICHI-SHI, MIE, 512-8041, JAPAN
Covered Property
(1)
Method for Processing Wide-Bandgap Semiconductor Substrate and Apparatus Therefor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.