Patent Assignment
Reel/Frame 057156/0255
Merger
Recorded: 2021-08-10
Pages: 7
Assignees
OSAKA UNIVERSITY
1-1, YAMADAOKA,, SUITA-SHI, OSAKA, 565-0871, JAPAN
TOHOKOKI CO., LTD.
38 KOGANE-CHO,, YOKKAICHI-SHI, MIE, 512-8062, JAPAN
Covered Property
(1)
Method for Processing Wide-Bandgap Semiconductor Substrate and Apparatus Therefor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.