Patent Assignment
Reel/Frame 040223/0617
Assignment of Assignor's Interest
Recorded: 2016-10-04
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2016-09-29
KUO, HUNG-JUI
Executed: 2016-09-29
TSAI, HUI-JUNG
Executed: 2016-09-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Dense Redistribution Layers in Semiconductor Packages and Methods of Forming the Same