IP Library › Assignment 040254/0620
Patent Assignment
Reel/Frame 040254/0620

Assignment of Assignor's Interest

Recorded: 2016-11-08 Pages: 9
Assignors
WANG, GANG
Executed: 2016-07-25
LIBBERT, JEFFREY L.
Executed: 2016-07-27
LIU, QINGMIN
Executed: 2016-07-18
USENKO, ALEX
Executed: 2016-11-08
THOMAS, SHAWN GEORGE
Executed: 2016-07-19
Assignee
SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
9 BATTERY ROAD, #15-01 STRAITS TRADING BUILDING, SINGAPORE, 049910, SINGAPORE
Covered Property (1)
Methods for Preparing Layered Semiconductor Structures and Related Bonded Structures
Application: 15/191,975 →
Publication: US 2017/0025306
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →