Patent Assignment
Reel/Frame 040254/0943
Assignment of Assignor's Interest
Recorded: 2016-11-08
Pages: 9
Assignors
PHU CUONG, DAO NGUYEN
Executed: 2014-08-04
CHUNG FOH, BARTHOLOMEW LIAO
Executed: 2014-08-04
DO, BYUNG TAI
Executed: 2014-07-29
KIM, KYUNG MOON
Executed: 2014-07-11
PUNZALAN, JEFFREY DAVID
Executed: 2014-07-29
CHAI, SEUNGYONG
Executed: 2014-07-14
LEE, SOO WON
Executed: 2014-06-27
SZETO, KWOK KEUNG
Executed: 2014-07-29
KIM, KYUNGOE
Executed: 2014-07-14
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Substrate and Method of Manufacture Thereof
Patent:
10,109,587 →
Application:
15/226,735 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.