Patent Assignment
Reel/Frame 040581/0250
Change of Name
Recorded: 2016-11-09
Pages: 5
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, #04-08/09 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Properties
(3)
Integrated Circuit Packaging System with Interposer Structure and Method of Manufacture Thereof
Patent:
9,659,897 →
Application:
15/167,895 →
Integrated Circuit Packaging System with Photoimagable Dielectric-Defined Trace and Method of Manufacture Thereof
Patent:
9,679,769 →
Application:
15/199,751 →
Integrated Circuit Packaging System with Substrate and Method of Manufacture Thereof
Patent:
10,109,587 →
Application:
15/226,735 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 8, 2016
From: CAMACHO, ZIGMUND RAMIREZ; ESPIRITU, EMMANUEL; CHUNG FOH, BARTHOLOMEW LIAO; PHU CUONG, DAO NGUYEN
To: STATS CHIPPAC LTD.
Reel/Frame 040254/0597 →
Assignment of Assignor's Interest
Nov 8, 2016
From: CAMACHO, ZIGMUND RAMIREZ; CHUNG FOH, BARTHOLOMEW LIAO; ALVAREZ, SHEILA MARIE L.; PHU CUONG, DAO NGUYEN
To: STATS CHIPPAC LTD.
Reel/Frame 040254/0840 →
Assignment of Assignor's Interest
Nov 8, 2016
From: PHU CUONG, DAO NGUYEN; CHUNG FOH, BARTHOLOMEW LIAO; DO, BYUNG TAI; KIM, KYUNG MOON
To: STATS CHIPPAC LTD.
Reel/Frame 040254/0943 →