IP Library Assignment 040258/0903
Patent Assignment
Reel/Frame 040258/0903

Assignment of Assignor's Interest

Recorded: 2016-11-08 Pages: 5
Assignors
KAGESHIMA, YOSHIAKI
Executed: 2016-10-17
MUTO, DAISUKE
Executed: 2016-10-17
MOMOSE, KENJI
Executed: 2016-10-17
MIYASAKA, YOSHIHIKO
Executed: 2016-10-17
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property (1)
Sic Epitaxial Wafer and Method for Producing Same, and Device for Producing Sic Epitaxial Wafer
Patent: 9,768,047 →
Application: 15/260,152 →
Publication: US 2016/0379860
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →