Patent Assignment
Reel/Frame 040302/0122
Assignment of Assignor's Interest
Recorded: 2016-10-11
Pages: 4
Assignor
QUALCOMM SWITCH CORP
Executed: 2016-05-19
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Integrated Circuit Assembly Having Bonded and Singulated Wafer Portions
Application:
15/173,251 →
Publication:
US 2016/0284671
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 11, 2016
From: SILANNA SEMICONDUCTOR U.S.A., INC.
To: QUALCOMM SWITCH CORP
Reel/Frame 040302/0129 →
Assignment of Assignor's Interest
Oct 11, 2016
From: STUBER, MICHAEL A.; MOLIN, STUART B.; DRUCKER, MARK; FOWLER, PETER
To: IO SEMICONDUCTOR, INC.
Reel/Frame 039981/0861 →
Change of Name
Oct 21, 2016
From: IO SEMICONDUCTOR INCORPORATED
To: SILANNA SEMICONDUCTOR U.S.A., INC.
Reel/Frame 040461/0930 →