IP Library Assignment 040461/0930
Patent Assignment
Reel/Frame 040461/0930

Change of Name

Recorded: 2016-10-21 Pages: 3
Assignor
IO SEMICONDUCTOR INCORPORATED
Executed: 2014-04-29
Assignee
SILANNA SEMICONDUCTOR U.S.A., INC.
4795 EASTGATE MALL, SAN DIEGO, CALIFORNIA, 92121
Covered Property (1)
Integrated Circuit Assembly Having Bonded and Singulated Wafer Portions
Application: 15/173,251 →
Publication: US 2016/0284671
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 11, 2016
From: QUALCOMM SWITCH CORP
To: QUALCOMM INCORPORATED
Reel/Frame 040302/0122 →
Change of Name Oct 11, 2016
From: SILANNA SEMICONDUCTOR U.S.A., INC.
To: QUALCOMM SWITCH CORP
Reel/Frame 040302/0129 →
Assignment of Assignor's Interest Oct 11, 2016
From: STUBER, MICHAEL A.; MOLIN, STUART B.; DRUCKER, MARK; FOWLER, PETER
To: IO SEMICONDUCTOR, INC.
Reel/Frame 039981/0861 →