IP Library Assignment 040337/0560
Patent Assignment
Reel/Frame 040337/0560

Assignment of Assignor's Interest

Recorded: 2016-11-16 Pages: 3
Assignors
KIM, HONG WON
Executed: 2016-11-09
JEONG, TAE SUNG
Executed: 2016-11-09
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property (1)
Fan-Out Semiconductor Package and Method of Manufacturing Same
Application: 15/352,668 →
Publication: US 2017/0263573
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →