Patent Assignment
Reel/Frame 040414/0014
Assignment of Assignor's Interest
Recorded: 2016-11-23
Pages: 3
Assignors
KAKUTANI, OSAMU
Executed: 2016-09-14
TAZAWA, HIDEHIRO
Executed: 2016-09-15
TUJI, MASAHITO
Executed: 2016-09-15
Assignee
SHINKAWA LTD.
51-1 INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Bonding Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.