Patent Assignment
Reel/Frame 040435/0284
Assignment of Assignor's Interest
Recorded: 2016-11-28
Pages: 4
Assignors
LEE, WEI-HSUAN
Executed: 2016-11-01
DING, JAW-MING
Executed: 2016-11-01
CHEN, WEI-YU
Executed: 2016-11-01
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Device and Method of Manufacturing the Same