Semiconductor package device and method of manufacturing the same
A semiconductor package device includes a substrate, a passive component, an active component and a package body. The passive component is disposed on the substrate. The active component is disposed on the substrate. The package body is disposed on the substrate. The package body includes a first portion covering the active component and the passive component, and a second portion covering the passive component. A top surface of the second portion of the package body is higher than a top surface of the first portion of the package body.
1. A semiconductor package device comprising:
a substrate having a top surface;
a passive component disposed on the substrate and having a top surface;
an active component disposed on the substrate and having a top surface; and
a package body disposed on the substrate, the package body comprising a first portion covering the active component and the passive component, and a second portion covering the passive component, wherein a top surface of the second portion of the package body is higher than a top surface of the first portion of the package body,
wherein a distance between the top surface of the active component and the top surface of the substrate is greater than a distance between the top surface of the passive component and the top surface of the substrate.
2. The semiconductor package device according to claim 1 , further comprising a conductive layer disposed on the package body.
3. The semiconductor package device according to claim 1 , wherein the top surface of the first portion of the package body is aligned with a backside surface of the active component.
4. The semiconductor package device according to claim 1 , wherein the top surface of the first portion of the package body is aligned with a backside surface of the passive component.
5. The semiconductor package device according to claim 1 , wherein the second portion of the package body comprises a cured photosensitive material.
6. The semiconductor package device according to claim 1 , wherein an area of the second portion of the package body is larger than an area of the passive component.
7. The semiconductor package device according to claim 1 , wherein a distance from the top surface of the second portion of the package body to a backside surface of the passive component is in a range from about 50 micrometers (μm) to about 100 μm.
8. The semiconductor package device of claim 2 , wherein the conductive layer is conformal with the package body.
9. The semiconductor package device of claim 2 , wherein a backside surface of the active component contacts the conductive layer.
10. The semiconductor package device of claim 1 , wherein a portion of the passive component is exposed from the first portion of the package body and is covered by the second portion of the package body.
11. The semiconductor package device according to claim 1 , wherein the top surface of the first portion of the package body is substantially coplanar with the top surface of the active component.
12. A semiconductor package device, comprising:
a substrate;
a passive component disposed on the substrate;
an active component disposed on the substrate;
a first package body disposed on the substrate and covering at least a portion of the passive component and the active component; and
a second package body disposed on a portion of the first package body and over the passive component,
wherein a distance between a top surface of the second package body and a top surface of the substrate is greater than a distance between a top surface of the first package body and the top surface of the substrate.
13. The semiconductor package device according to claim 12 , further comprising a conductive layer disposed on the first package body and the second package body.
14. The semiconductor package device according to claim 12 , wherein the conductive layer contacts a backside surface of the active component.
15. The semiconductor package device according to claim 12 , wherein the top surface of the first package body is aligned with a backside surface of the active component.
16. The semiconductor package device according to claim 12 , wherein the top surface of the first package body is aligned with a backside surface of the passive component.
17. The semiconductor package device according to claim 12 , wherein a backside surface of the passive component is exposed from the first package body and is covered by the second package body.
18. The semiconductor package device according to claim 12 , wherein the first package body and the second package body comprise a same material.
19. The semiconductor package device according to claim 12 , wherein the first package body and the second package body comprise different materials and the second package body comprises a photosensitive material.
20. The semiconductor package device according to claim 19 , wherein the second package body comprises a cured photosensitive material.
21. The semiconductor package device according to claim 12 , wherein a distance from the top surface of the second package body to a backside surface of the passive component is in a range from about 50 μm to about 100 μm.