Patent Assignment
Reel/Frame 040539/0655
Assignment of Assignor's Interest
Recorded: 2016-12-06
Pages: 3
Assignors
HUNG, JUI-PIN
Executed: 2016-12-05
HSU, FENG-CHENG
Executed: 2016-11-24
CHEN, SHUO-MAO
Executed: 2016-11-24
JENG, SHIN-PUU
Executed: 2016-11-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method of the Same