Patent Assignment
Reel/Frame 040705/0566
Assignment of Assignor's Interest
Recorded: 2016-12-12
Pages: 8
Assignee
J-DEVICES CORPORATION
1913-2 FUKURA, USUKI-SHI, OITA, 8750053, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Package, and Semiconductor Package
Application:
15/375,241 →
Publication:
US 2017/0207157
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 25, 2020
From: J-DEVICES CO., LTD.
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 053597/0184 →
Corrective Assignment to Correct the Conveying Party Name Previously Recorded at Reel: 53597 Frame: 184. Assignor(S) Hereby Confirms the Assignment.
Mar 5, 2021
From: J-DEVICES CORPORATION
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 055605/0060 →