Patent Assignment
Reel/Frame 040791/0385
Assignment of Assignor's Interest
Recorded: 2016-12-28
Pages: 6
Assignors
TAO, MIN
Executed: 2016-07-22
KIM, HOKI
Executed: 2016-10-27
PRABHU, ASHOK S.
Executed: 2016-08-08
SUN, ZHUOWEN
Executed: 2016-07-22
ZOHNI, WAEL
Executed: 2016-07-22
HABA, BELGACEM
Executed: 2016-07-22
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Package-on-Package Devices with WLP Components with Dual RDLS for Surface Mount Dies and Methods Therefor
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0758 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0807 →