Patent Assignment
Reel/Frame 040800/0379
Assignment of Assignor's Interest
Recorded: 2016-12-29
Pages: 4
Assignors
YANG, MING-TZONG
Executed: 2016-12-29
HUNG, CHENG-CHOU
Executed: 2016-12-29
HUANG, WEI-CHE
Executed: 2016-12-29
HUANG, YU-HUA
Executed: 2016-12-29
LIN, TZU-HUNG
Executed: 2016-12-29
CHAN, KUEI-TI
Executed: 2016-12-29
WU, RUEY-BEEI
Executed: 2016-12-29
WU, KAI-BIN
Executed: 2016-12-29
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST., SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Package Assembly with Through Silicon via Interconnect