Patent Assignment
Reel/Frame 040816/0964
Assignment of Assignor's Interest
Recorded: 2017-01-02
Pages: 3
Assignee
COMPASS TECHNOLOGY COMPANY LIMITED
SUITE 10, 5/F, CHIAHPUA CENTRE, 12 SIU LEK YUEN ROAD, SHATIN, HONG KONG
Covered Property
(1)
Fabrication Process and Structure of Fine Pitch Traces for a Solid State Diffusion Bond on Flip Chip Interconnect
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.