Patent Assignment
Reel/Frame 040827/0272
Assignment of Assignor's Interest
Recorded: 2016-12-02
Pages: 5
Assignors
KIM, JUNG SOO
Executed: 2016-11-24
BYUN, DAE JUNG
Executed: 2016-11-24
LEE, DOO HWAN
Executed: 2016-11-24
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.