Patent Assignment
Reel/Frame 040844/0479
Assignment of Assignor's Interest
Recorded: 2017-01-04
Pages: 3
Assignors
PARK, MYUNG HO
Executed: 2016-12-23
KIM, BEOM SU
Executed: 2016-12-23
KIM, SUN HWAN
Executed: 2016-12-23
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO 361-725, CHEONGJU-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer-Level Chip-Scale Package Including Power Semiconductor and Manufacturing Method Thereof