Wafer-level chip-scale package including power semiconductor and manufacturing method thereof
A wafer-level chip-scale package includes: a power semiconductor comprising a first semiconductor device formed on a semiconductor substrate, and a second semiconductor device formed on the semiconductor substrate; a common drain electrode connected to the first semiconductor device and the second semiconductor device; a first source metal bump formed on a surface of the first semiconductor device; and a second source metal bump formed on the surface of the second semiconductor device; wherein the first source metal bump, the common drain electrode, and the second source metal bump form a current path in an order of the first source metal bump, the common drain electrode, and the second source metal bump.
1. A wafer-level chip-scale package comprising:
a semiconductor substrate having an upper surface and a lower surface;
a power semiconductor device comprising a first semiconductor device and a second semiconductor device formed in the semiconductor substrate;
a common drain electrode connected to the first semiconductor device and the second semiconductor device;
a first source metal bump on a first source pad formed on the upper surface of the semiconductor substrate; and
a second source metal bump on a second source pad formed on the upper surface of the semiconductor substrate,
wherein the common drain electrode comprises:
a back metal layer comprising nickel-vanadium and silver (NiV/Ag) and disposed on a lower surface of the semiconductor substrate,
a first metal layer comprising copper (Cu) or silver (Ag) and disposed on the back metal layer, and
a second metal layer comprising nickel (Ni) and disposed on the first metal layer, and
wherein the first metal layer is thicker than the second metal layer, and is disposed between the back metal layer and the second metal layer.
2. The wafer-level chip-scale package of claim 1 , further comprising:
a first gate electrode formed in the first semiconductor device;
a first gate pad electrically connected to the first gate electrode;
a first gate input lead;
a first source input lead;
a first resistor disposed between the first gate input lead and the first gate electrode; and
a first Zener diode disposed between the first gate input lead and the first source input lead.
3. The wafer-level chip-scale package of claim 1 , wherein:
the back metal layer comprising NiV/Ag is a sputtering metal layer deposited by a sputtering method;
the first metal layer comprising Cu or Ag is a first electroplated metal layer deposited by an electroplating method; and
the second metal layer comprising Ni is a second electroplated metal layer deposited by the electroplating method.
4. The wafer-level chip-scale package of claim 1 , wherein a thickness of the first metal layer is between 5 um and 30 um.
5. The wafer-level chip-scale package of claim 1 , wherein the second metal layer comprising nickel forms an outermost layer of the common drain electrode.
6. The wafer-level chip-scale package of claim 1 , wherein:
each of the first source metal bump and the second source metal bump comprises a seed metal layer and a solderable metal layer formed on the seed metal layer,
the seed metal layer comprises titanium (Ti) and copper (Cu), and
the solderable metal layer comprises copper (Cu), nickel (Ni) and gold (Au).
7. The wafer-level chip-scale package of claim 1 , wherein the power semiconductor device comprises a dual n-channel.
8. The wafer-level chip-scale package of claim 1 , wherein each of the first semiconductor device and the second semiconductor device comprises a trench MOSFET device.
9. The wafer-level chip-scale package of claim 1 , further comprising a gate control semiconductor device disposed on the power semiconductor device.
10. The wafer-level chip-scale package of claim 1 , wherein a resistance between the first source bump and the second source bump is less than 10 mΩ when a power switch for the power semiconductor device is in an on configuration.
11. The wafer-level chip-scale package of claim 1 , further comprising:
a second gate electrode formed in the second semiconductor device;
a second gate pad electrically connected to the second gate electrode;
a second gate input lead;
a second source input lead;
a second resistor disposed between the second gate input lead and the second gate electrode; and
a second Zener diode disposed between the second gate input lead and the second source input lead.
12. The wafer-level chip-scale package of claim 1 , further comprising:
a passivation layer formed on the semiconductor substrate to overlap the respective first and second source pad; and
a polyimide layer being formed on the passivation layer.
13. A wafer-level chip-scale package comprising:
a semiconductor substrate having a upper surface and a lower surface;
a power semiconductor device comprising a first semiconductor device and a second semiconductor device formed in the semiconductor substrate;
a first source metal bump formed on the upper surface of the semiconductor substrate;
a second source metal bump formed on the upper surface of the semiconductor substrate;
a back metal layer formed on the lower surface of the semiconductor substrate;
a first metal layer comprising copper and formed on the back metal layer; and
a second metal layer comprising nickel, formed on the first metal layer to form an outermost layer of the wafer-level chip-scale package, and being thinner than the first metal layer,
wherein the back metal layer, the first metal layer and the second metal layer are aligned with an edge of the power semiconductor device.
14. The wafer-level chip-scale package of claim 13 , wherein the back metal layer is a sputtered metal layer deposited by a sputtering method, and the first metal layer comprising copper is a first electroplated metal layer deposited by an electroplating method.
15. The wafer-level chip-scale package of claim 14 , wherein the first electroplated metal layer has a thickness greater than a thickness of the sputtered metal layer.
16. A wafer-level chip-scale package comprising:
a power semiconductor device comprising a first semiconductor device and a second semiconductor device, each formed in a semiconductor substrate;
a common drain electrode connected to the first semiconductor device and the second semiconductor device;
a first source metal bump on a first source pad and formed on an upper surface of the semiconductor substrate; and
a second source metal bump on a second source pad and formed on the upper surface of the semiconductor substrate, the first and the second source metal bumps each comprising a seed metal layer,
wherein the common drain electrode comprises:
a back metal layer comprising nickel-vanadium and silver (NiV/Ag) and disposed on a lower surface of the semiconductor substrate;
a first metal layer comprising copper (Cu) and disposed on the back metal layer, and
a second metal layer comprising nickel (Ni) and disposed on the first metal layer to form an outermost layer of the common drain electrode.
17. The wafer-level chip-scale package of claim 16 , further comprising:
a gate electrode in the power semiconductor device;
a gate pad electrically connected to the gate electrode;
a gate input lead;
a source input lead;
a resistor disposed between the gate input lead and the gate electrode; and
a Zener diode disposed between the gate input lead and the source input lead.
18. The wafer-level chip-scale package of claim 16 , wherein the back metal layer comprising NiV/Ag is a sputter metal layer deposited by a sputtering method, the first metal layer comprising copper is a first electroplated metal layer deposited by an electroplating method, and the second metal layer comprising Ni is a second electroplated metal layer deposited by the electroplating method, and
wherein the first electroplated metal layer is thicker than the second electroplated metal layer.
19. The wafer-level chip-scale package of claim 16 , wherein each of the first and second source metal bumps further comprises a solderable metal layer formed on the seed metal layer, and
wherein the seed metal layer comprises titanium (Ti) and copper (Cu), and
wherein the solderable metal layer comprises copper (Cu), nickel (Ni) and gold (Au).