Patent Assignment
Reel/Frame 040862/0329
Assignment of Assignor's Interest
Recorded: 2017-01-05
Pages: 2
Assignors
KUAN, WAN-CHUN
Executed: 2017-01-03
LIAO, CHIH-TENG
Executed: 2017-01-04
CHIU, YI-WEI
Executed: 2017-01-03
WENG, TZU-CHAN
Executed: 2017-01-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Integrated Circuit Structure having Crown-Shaped Semiconductor Strips and Recesses in the Substrate from Etched Dummy Fins