Integrated circuit structure having crown-shaped semiconductor strips and recesses in the substrate from etched dummy fins
An integrated circuit structure includes a semiconductor substrate having a plurality of semiconductor strips, a first recess being formed by two adjacent semiconductor strips among the plurality of semiconductor strips, a second recess being formed within the first recess, and an isolation region being provided in the first recess and the second recess. The second recess has a lower depth than the first recess.
1. An integrated circuit structure comprising:
a semiconductor substrate having a plurality of semiconductor strips, wherein one of the plurality of semiconductor strips comprises:
a base; and
a plurality of semiconductor fins directly over and connected to the base;
a first recess being formed by two adjacent semiconductor strips among the plurality of semiconductor strips;
a second recess being formed directly underlying, and joined to, the first recess, wherein the second recess extends from a bottom level of the base down into the semiconductor substrate, and wherein the base and the second recess have substantially a same width, and wherein the second recess has a top width smaller than a bottom width of the first recess; and
an isolation region being provided in the first recess and the second recess, wherein the second recess has a lower depth than the first recess.
2. The integrated circuit structure of claim 1 , wherein the second recess has a U-shaped bottom.
3. The integrated circuit structure of claim 2 , wherein the U-Shaped bottom of the second recess has a plurality of divots.
4. The integrated circuit structure of claim 3 , wherein the plurality of divots have rounded bottoms.
5. The integrated circuit structure of claim 3 , wherein the plurality of divots and the plurality of semiconductor fins are parallel to each other and have substantially a uniform pitch.
6. The integrated circuit structure of claim 3 , wherein the plurality of divots have a first total count, and the plurality of semiconductor fins have a second total count equal to the first total count.
7. The integrated circuit structure of claim 1 , wherein the plurality of semiconductor strips further comprises a plurality of single-fin strips, wherein the plurality of single-fin strips and the plurality of semiconductor fins have a uniform pitch.
8. The integrated circuit structure of claim 1 , wherein one of the plurality of semiconductor strips has substantially a same width as the plurality of semiconductor fins.
9. An integrated circuit structure comprising:
a semiconductor substrate;
isolation regions extending into the semiconductor substrate;
a first semiconductor strip comprised in the semiconductor substrate, wherein the first semiconductor strip is a crown-shaped semiconductor strip comprising:
a base in the isolation region; and
a plurality of semiconductor fins directly over the base;
a second semiconductor strip comprised in the semiconductor substrate, wherein the second semiconductor strip is a single-fin semiconductor strip;
a first recess between first two adjacent semiconductor strips;
a second recess being formed underlying the first recess, the second recess extending from a bottom levels of the first two adjacent semiconductor strips into a lower portion of the semiconductor substrate, wherein the isolation regions comprise a first portion extending into the second recess, and the second recess and the base of the first semiconductor strip have substantially a same width;
a third recess between two adjacent semiconductor strips; and
a fourth recess being formed underlying the third recess, the fourth recess extending from bottom levels of the two adjacent semiconductor strips into the lower portion of the semiconductor substrate, wherein the isolation regions comprise a second portion extending into the fourth recess, and the fourth recess and the second semiconductor strip have substantially a same width.
10. The integrated circuit structure of claim 9 , wherein the second semiconductor strip, the plurality of semiconductor fins, and the fourth recess are parallel to each other and have substantially a uniform pitch.
11. The integrated circuit structure of claim 9 , wherein the fourth recess has a V-shaped bottom.
12. The integrated circuit structure of claim 9 , wherein the second recess has a U-shaped cross-sectional view, with divots at a bottom of the second recess.
13. The integrated circuit structure of claim 12 , wherein the divots, the second semiconductor strip, the plurality of semiconductor fins, and the fourth recess are aligned to parallel lines having substantially a uniform pitch.
14. The integrated circuit structure of claim 12 , wherein the divots have a first total count, and the plurality of semiconductor fins have a second total count equal to the first total count.
15. The integrated circuit structure of claim 9 further comprising:
an epitaxy semiconductor region over a portion of the base, wherein the epitaxy semiconductor region comprises upward facing facets and downward facing facets; and
a gate stack on the plurality of semiconductor fins.
16. An integrated circuit structure comprising:
a semiconductor substrate comprising a bulk portion;
a crown-shaped semiconductor strip comprising:
a base over and joined to a top surface of the bulk portion of the semiconductor substrate; and
a plurality of semiconductor fins overlapping and joined to the base;
a first recess extending from the top surface of the bulk portion of the semiconductor substrate down into the bulk portion of the semiconductor substrate, wherein the first recess and the plurality of semiconductor fins are aligned to positions of parallel lines that have a uniform pitch; and
an isolation region extending into the first recess, wherein the base is in the isolation region.
17. The integrated circuit structure of claim 16 , wherein the first recess has a width close to a width of one of the plurality of semiconductor fins.
18. The integrated circuit structure of claim 16 further comprising a second recess extending from the top surface of the bulk portion of the semiconductor substrate down into the bulk portion of the semiconductor substrate, wherein the second recess has a width close to a width of the base.
19. The integrated circuit structure of claim 16 , wherein the first recess has a U-shaped or V-shaped bottom.
20. The integrated circuit structure of claim 16 further comprising:
a gate dielectric contacting sidewalls of the plurality of semiconductor fins and a top surface of the base; and
a gate electrode over a bottom portion of the gate dielectric.