Patent Assignment
Reel/Frame 040874/0059
Assignment of Assignor's Interest
Recorded: 2017-01-06
Pages: 4
Assignors
HUANG, LI-HSIEN
Executed: 2016-12-13
SU, AN-JHIH
Executed: 2016-12-13
WU, CHI-HSI
Executed: 2016-12-13
YU, CHEN-HUA
Executed: 2016-12-13
YEH, DER-CHYANG
Executed: 2016-12-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Redistribution Layers in Semiconductor Packages and Methods of Forming Same