Patent Assignment
Reel/Frame 040903/0522
Assignment of Assignor's Interest
Recorded: 2017-01-09
Pages: 3
Assignors
LIU, KUAN-LIANG
Executed: 2016-11-18
HUANG, XIN-HUA
Executed: 2016-11-18
TU, YEUR-LUEN
Executed: 2016-11-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Method of Semiconductor Wafer Bonding and System Thereof