IP Library Assignment 040908/0313
Patent Assignment
Reel/Frame 040908/0313

Assignment of Assignor's Interest

Recorded: 2016-12-13 Pages: 5
Assignors
LEE, DOO HWAN
Executed: 2016-12-05
KIM, JONG RIP
Executed: 2016-12-05
KIM, HYOUNG JOON
Executed: 2016-12-05
KIM, JIN YUL
Executed: 2016-12-05
OH, KYUNG SEOB
Executed: 2016-12-05
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Fan-Out Semiconductor Package
Application: 15/377,402 →
Publication: US 2017/0365566
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →