Patent Assignment
Reel/Frame 040946/0071
Assignment of Assignor's Interest
Recorded: 2017-01-11
Pages: 6
Assignors
JUNG, DEOKYOUNG
Executed: 2016-08-19
MOON, KWANGJIN
Executed: 2016-08-19
PARK, BYUNG LYUL
Executed: 2016-08-19
AN, JIN HO
Executed: 2016-08-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including a Through via Structure and Methods of Forming the Same