IP Library › Assignment 041055/0504
Patent Assignment
Reel/Frame 041055/0504

Assignment of Assignor's Interest

Recorded: 2017-01-24 Pages: 3
Assignors
LEE, MIHEE
Executed: 2017-01-20
SUH, JUNG-JU
Executed: 2017-01-20
Assignee
3M INNOVATIVE PROPERTIES COMPANY
P.O. BOX 33427, SAINT PAUL, MINNESOTA, 55133-3427
Covered Property (1)
Electronic Circuit Board Assembly Including Emi Shielding Structure and Thermal Pad
Application: 15/328,535 →
Publication: US 2017/0251549