Electronic circuit board assembly including EMI shielding structure and thermal pad
Provided is an electronic circuit board assembly. The electronic circuit board assembly includes an electronic circuit board, a plurality of electronic circuit devices disposed on the electronic circuit board, an electromagnetic interference (EMI) shielding structure configured to shield an electromagnetic wave generated from the plurality of electronic circuit devices, and a thermal pad configured to dissipate heat generated from the plurality of electronic circuit devices. The EMI shielding structure covers the plurality of electronic circuit devices and is attached to the electronic circuit board, and the thermal pad is disposed between the plurality of electronic circuit devices and the EMI shielding structure, contacts the plurality of electronic circuit devices and the EMI shielding structure, and thereby can transfers the heat generated from the plurality of electronic circuit devices to the EMI shielding structure.
1. An electronic circuit board assembly, comprising:
an electronic circuit board;
a plurality of electronic circuit devices disposed on the electronic circuit board;
an electromagnetic interference (EMI) shielding structure configured to shield an electromagnetic wave generated from the plurality of electronic circuit devices; and
a thermal pad configured to dissipate heat generated from the plurality of electronic circuit devices,
wherein the EMI shielding structure covers the plurality of electronic circuit devices and is also attached to the electronic circuit board, and the thermal pad is disposed between the plurality of electronic circuit devices and the EMI shielding structure, contacts the plurality of electronic circuit devices and the EMI shielding structure, and thereby transfers the heat generated from the plurality of electronic circuit devices to the EMI shielding structure, wherein the thermal pad is compressed to fill a space defined between the EMI shielding structure and the plurality of electronic circuit devices, and wherein a compression set of the thermal pad is 70% or more.
2. The assembly of claim 1 , wherein at least one of the plurality of electronic circuit devices has a height different from other electronic circuit devices; and wherein the thermal pad is a single sheet.
3. The assembly of claim 2 , wherein the compression set of the thermal pad is 95% or more.
4. The assembly of claim 1 , wherein the EMI shielding structure is an EMI shielding tape.
5. The assembly of claim 1 , wherein the thermal pad includes a polymer matrix and a filler,
wherein the polymer matrix includes at least one of a silicone elastomer and an acrylic polymer, and the filler includes at least one of aluminum oxide, aluminum hydroxide, aluminum nitride, and boron nitride, and is an electrical insulator.
6. An electronic device comprising the electronic circuit board assembly according to claim 1 .
7. The device of claim 6 , wherein the electronic device is a smart phone, a smart pad, or a portable computer.