Patent Assignment
Reel/Frame 041124/0456
Assignment of Assignor's Interest
Recorded: 2017-01-30
Pages: 4
Assignors
MATSUBARA, HIROAKI
Executed: 2017-01-21
CHIKAI, TOMOSHIGE
Executed: 2017-01-21
HAYASHI, NAOKI
Executed: 2017-01-21
IWASAKI, TOSHIHIRO
Executed: 2017-01-21
Assignee
J-DEVICES CORPORATION
1913-2, AZA-TAKEGASHITA, OAZA FUKURA, USUKI-SHI, OITA, 875-0053, JAPAN
Covered Property
(1)
Interconnect Structure, Printed Circuit Board, Semiconductor Device, and Manufacturing Method for Interconnect Structure
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 25, 2020
From: J-DEVICES CO., LTD.
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 053597/0184 →
Corrective Assignment to Correct the Conveying Party Name Previously Recorded at Reel: 53597 Frame: 184. Assignor(S) Hereby Confirms the Assignment.
Mar 5, 2021
From: J-DEVICES CORPORATION
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 055605/0060 →