Patent Assignment
Reel/Frame 041125/0581
Assignment of Assignor's Interest
Recorded: 2017-01-30
Pages: 4
Assignor
SOITEC S.A.
Executed: 2016-06-12
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 243-0014, JAPAN
Covered Properties
(4)
Methods of Forming Bonded Semiconductor Structures, and Semiconductor Structures Formed by Such Methods
Application:
13/077,292 →
Publication:
US 2012/0248621
System and Method for Assessing Inhomogeneous Deformations in Multilayer Plates
Method for Bonding Semiconductor Wafers Using a Molecular Bonding Apparatus
Application:
14/722,794 →
Publication:
US 2015/0279830
Apparatus for Molecular Adhesion Bonding with Compensation for Radial Misalignment
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 12, 2011
From: SADAKA, MARIAM
To: S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
Reel/Frame 026270/0290 →
Change of Name
Feb 28, 2012
From: S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES; CHEMIN DES FRANQUES; PARC TECHNOLOGIES DES FONTAINES; BERNIN. FRANCE 38190
To: SOITEC
Reel/Frame 028138/0895 →
Assignment of Assignor's Interest
Nov 12, 2012
From: BROEKAART, MARCEL; CASTEX, ARNAUD; MARINIER, LAURENT
To: SOITEC
Reel/Frame 029283/0331 →