Patent Assignment
Reel/Frame 041134/0250
Merger
Recorded: 2016-12-21
Pages: 4
Assignor
TESSERA INTERCONNECT MATERIALS, INC.
Executed: 2011-12-19
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Microelectronic Interconnect Element with Decreased Conductor Spacing
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 19, 2016
From: RYU, CHANG MYUNG; ENDO, KIMITAKA; HABA, BELGACEM; KUBOTA, YOICHI
To: TESSERA, INC.
Reel/Frame 040668/0639 →
Assignment of Assignor's Interest
Dec 20, 2016
From: TESSERA, INC.
To: TESSERA INTERCONNECT MATERIALS, INC.
Reel/Frame 040692/0575 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0758 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0807 →