Patent Assignment
Reel/Frame 041141/0856
Assignment of Assignor's Interest
Recorded: 2017-02-01
Pages: 6
Assignors
ISOZAKI, SEIYA
Executed: 2016-09-21
MORIYAMA, TAKASHI
Executed: 2016-09-16
MAEDA, TAKEHIKO
Executed: 2016-09-21
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU,, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device